eGovernment

Machine-readable eID documents, e.g. eDrivers Licenses, eID cards and ePassports, are seeing mass adoption with the increased introduction of tighter security controls in worldwide travel. The implementation of the US Greencard, US Passport Card and the new German eID Card in 2010 demonstrate the growing applications of secure eID documents. Manufacturers of contactless documents and components are constantly facing new challenges in the scope of long durability and high reliability for new eID documents. But the card structure is becoming more complex and requires more card layers to meet increasing security demands. KSW's innovative Thinlam® family meets these requirements and sets new, higher standards in contactless eID card manufacturing. Furthermore state-of-the-art eID documents and their components must comply with international interoperability standards and have to include a range of security features to combat counterfeiting and avoid tampering.

KSW Microtec’s products distinguish by their particular high level of reliability and lowest available layer thickness and offers ideal opportunity to work out individual card structure of eID documents. Alternative substrates combined with a diverse choice of RFID chips are applied to serve as secure and durable component in smart eID cards.

KSW offers innovative ICAO compliant Thinlam® card components made of PVC and Polycarbonate (PC) with contactless HF Microcontrollers for enhanced national ID cards which can also be used for passport data pages e.g. and Teslin® based products. Our UHF products are used e.g. for eDriver licenses in Canada and the US Green card.